TE Connectivity has introduced its Mezalok High-Speed Low-Force (HSLF) XMC connectors that supports data rate speeds up to 32+ Gbits/s for improved signal processing on embedded computing applications. The enhanced HSLF Mezalok connector is designed for mezzanine applications and meets legacy Mezalok high-speed connector qualifications
The HSLF Mezalok XMC mezzanine connectors with a rugged dual point contact system join TE’s family of rugged connectors designed for higher data rate applications. The connectors meet the same rugged standards as VITA 47 and VITA 72.
The XMC mezzanine connectors feature a wide operating temperature range and excellent thermal stability with a VITA 42.3 pinout, said the company, and are suited for aerospace, ground vehicle, marine, and missile defense applications. Thermal stability for solder joints has been tested to 2,000 thermal cycles over the temperature range of -55°C to 125°C.
The connector family is available in 60, 114, and 320 positions with multiple stack heights of 10, 12, 17, and 18 mm. The 114-position connector is compliant to VITA 61 standards and additional positions and stack heights are available.
The low-force connectors offers an unmating force reduction of 47% and a mating force reduction of 32%. The connectors use a ball-grid-array PCB surface-mount attachment.
Early this year, TE Connectivity increased the connector family’s data rate to 32 Mbits/s, driven by demand for higher processing power in military electronics applications.
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