Intel’s new CEO, Pat Gelsinger, recently announced at the JPMorgan Global TMC Week event that the 7-nanometer Meteor Lake processor computing module has completed the “Tape in” design certification completion stage, which represents The Meteor Lake processor design is ready.
According to foreign media reports, the 7nm process Meteor Lake processor will introduce major design changes for the new generation of Core-i series processors, that is, it is composed of multiple computing modules (Compute Tile) in a similar way to small chips, and replaces Golden Cove’s new Redwood Cove core architecture, expected to bring significant improvements in IPC performance and architecture, will succeed the 10nm Alder Lake and Raptor Lake processors.
In terms of the new Redwood Cove core architecture, it is reported that Intel previously redesigned the Redwood Cove architecture and adopted the extreme ultraviolet exposure technology (EUV) of the 7-nanometer process. Whether it will be manufactured in a different fab is currently unknown. Some reference materials point out that TSMC, the leader in foundry, will become an alternate foundry for RedwoodCove core architecture processors, and further foundry is not even ruled out.
The Meteor Lake processor may be Intel’s first product to bid farewell to the ring bus interconnect architecture. There are also rumors that Meteor Lake processors will be fully 3D stacked designs and utilize I/O processors produced by external foundries. It should be emphasized that Intel will officially use Foveros packaging technology in the new generation of CPU production, which is the same as the connection method of each computing module of the 14th generation Core-i.
Finally, Meteor Lake processors are expected to use the same LGA 1700 socket as the 12th-generation Alder Lake and 13th-generation Raptor Lake, and support DDR5 memory and PCIe 5.0. High-end products only support DDR5 memory, mainstream and entry-level CPUs are compatible with DDR4 memory.